SiMa.ai Advances Physical AI with Modalix™: Compact MLSoC for Robotics, AVs, and Automation

• SiMa.ai Launches Modalix™ to Tackle Power, Performance, and Integration Challenges in Physical AI

SiMa.ai, a leader in Physical AI solutions, today announced the production and immediate availability of its second-generation Machine Learning System-on-Chip (MLSoC™) – Modalix™ – designed to accelerate the scaling of Physical AI across industries.

As sectors such as robotics, autonomous vehicles, industrial automation, and aerospace increasingly push AI to the edge, they face a common challenge: achieving high performance within the strict power, size, and integration constraints of edge devices. Cloud-based AI often falls short due to latency and high energy consumption. Modalix™ addresses this gap by delivering high performance and accuracy under 10 watts, capable of running LLMs, transformers, CNNs, and GenAI workloads efficiently.

Performance, Flexibility, and Low Power

Built on a flexible Arm-based architecture with a native GenAI software stack, Modalix™ supports real-time perception, decision-making, and natural language interaction. Its compatibility with key interfaces such as camera, Ethernet, and PCIe makes it adaptable for use in robotics, automotive, industrial automation, aerospace and defense, smart vision, retail, and healthcare applications.

Complete Platform for Physical AI

Alongside Modalix™, SiMa.ai introduced:

• Pin-Compatible System-on-Module (SoM) – Developed with Enclustra, the compact, power-efficient SoM offers a drop-in replacement for leading GPU SoMs, integrating MIPI, memory, and essential I/O for rapid deployment.
• LLiMa™ Framework – A unified on-device platform for running LLMs, LMMs, and VLMs entirely offline, with features such as curated model zoo access, automated quantization/compilation, and support for agent-to-agent systems, MCP, and RAG.

The integrated Palette™ SDK software, enables developers to move from prototype to production quickly and cost-effectively.

Industry Partnerships Driving Innovation

“SiMa.ai’s Modalix showcases the scale of innovation possible on Arm’s flexible, high-performance, power-efficient compute platform,” said Ami Badani, Chief Marketing Officer, Arm. “By bringing AI and LLM capabilities to Physical AI applications at the edge, SiMa.ai is enabling smarter, faster, and more sustainable systems across industries.”

“The development of Physical AI applications requires validated, purpose-built silicon and software, only possible using advanced design solutions,” said Ravi Subramanian, Chief Product Management Officer, Synopsys. “Achieving a successful first tapeout of MLSoC Modalix illustrates the mission-critical role of Synopsys AI-powered design and IP.”

“This Enclustra–SiMa.ai SoM is more than just a module – it’s a ready-to-deploy Physical AI platform,” added Philipp Baechtold, CEO of Enclustra.

Leadership Perspective

“The era of Physical AI is here,” said Krishna Rangasayee, Founder and CEO of SiMa.ai. “With Modalix™ now in production, we’re accelerating its global adoption and simplifying on-device LLM deployment. Demand for our Modalix SoM is strong, and we’re enabling developers worldwide to bring GenAI to Physical AI systems faster than ever.”

TSMC’s advanced N6 process technology powers Modalix™, ensuring it meets stringent embedded power, thermal, and reliability demands. “TSMC is proud to collaborate with SiMa.ai to deliver advanced SoCs that meet the growing demand for Physical AI,” said Sajiv Dalal, President of TSMC North America.

About SiMa.ai

SiMa.ai is a leader in Physical AI, delivering a purpose-built, software-centric platform that brings best-in-class performance, power efficiency, and ease of use to Physical AI applications. Focused on scaling Physical AI across robotics, automotive, industrial automation, aerospace & defense, smart vision, and healthcare, SiMa.ai is led by seasoned technologists and backed by top-tier investors. Headquartered in San Jose, California. Learn more at www.sima.ai.

SiMa.ai Develops the Industry’s First Purpose-Built Machine Learning System-on-Chipwith TSMC’s Power Efficient Technology

Business Wire India

SiMa.ai, the machine learning company enabling effortless deployment and scaling at the embedded edge, today announced it has delivered a software-centric MLSoC Platform that enables quick and Effortless ML experiences for the embedded edge, benefiting from TSMC’s power efficient process technology and most comprehensive design ecosystem.

The SiMa.ai MLSoC, which is shipping to customers now, addresses any computer vision application and delivers a 10x better performance/watt solution – operating at the most efficient frames per second/watt. SiMa.ai’s push-button software experience allows users to effortlessly scale machine learning in minutes for robotics, smart vision, government, autonomous vehicles, drones, and healthcare applications.

As SiMa.ai’s foundry partner, TSMC manufactured SiMa.ai’s first-generation design of its MLSoC on the TSMC 16nm technology, which provides superior performance and optimal power consumption – an advantage for high-end edge applications.

“We partnered with TSMC to manufacture our MLSoC Platform because we wanted to work with the best. Our first-time-right silicon success allowed us to begin shipping products to customers immediately,” said Gopal Hegde, SVP Engineering & Operations, SiMa.ai. “Our customers have been waiting for a purpose-built software and hardware MLSoC platform and we are thrilled to work with TSMC to deliver the industry’s first and only solution that enables Effortless ML.”

For over three decades, TSMC has collaborated with countless innovative technology companies, helping them quickly launch their differentiated products to market with TSMC’s industry-leading process technology and manufacturing excellence. To help customers address design complexity and improve first-time silicon success, TSMC also works with its ecosystem partners via the most comprehensive design ecosystem, the TSMC Open Innovation Platform^® (OIP).

“TSMC has long-partnered with industry innovators to help them achieve the best possible power, performance and area (PPA) for their next-generation designs,” said Lucas Tsai, Director of Market Development and Emerging Business Management, TSMC North America. “We look forward to our continued collaboration with innovators like SiMa.ai to transform their forward-looking idea from inspiration into real products and enable advances in machine learning and countless other applications.”

The SiMa.ai MLSoC Platform is available today. For more information, visit https://sima.ai/get-10x-now/.

About SiMa.ai
SiMa.ai is a Machine Learning company delivering the industry’s first software-centric, purpose-built MLSoC platform. With push-button performance, we enable Effortless ML deployment and scaling at the embedded edge by allowing customers to address any computer vision problem while achieving 10x better performance at the lowest power. Initially focused on computer vision applications, SiMa.ai is led by technologists and business veterans backed by a set of top investors committed to helping customers bring ML on their platforms.

 

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