Showing posts with label VIHAAN. Show all posts
Showing posts with label VIHAAN. Show all posts

DLI Scheme-backed Aheesa, Zigma Partner to Take Indigenous VIHAAN‑I Chip Nationwide

DLI Scheme-backed Aheesa, Zigma Partner to Take Indigenous VIHAAN‑I Chip Nationwide

Aheesa Digital Innovations (Aheesa), a fabless semiconductor company, and The Zigma Technologies India (P) Limited (Zigma), an Indian technology, software, and e-governance services company, both headquartered in Chennai, have entered into a partnership with Zigma as the distribution partner to take VIHAAN-I, a first-of-its-kind indigenous networking chip, to market across India. Signed in the nation's financial capital Mumbai, this agreement brings together Aheesa's design capability with Zigma's to carry indigenous silicon to the market across India and beyond.

The partnership comes after Aheesa’s successful VIHAAN-I tape-out on Republic Day (January 2026) and first-pass silicon success on Independence Day (August 2026), achieved on its very first attempt. This chip will help reduce dependence on imported networking silicon and to support locally manufactured broadband devices. Taking a chip like this into the country's networks calls for a partner already embedded in the systems, and Zigma has spent close to three decades in precisely that terrain, delivering technology and e-governance infrastructure to OEMs, ODMs and government departments nationwide.

The chip will now proceed towards production, targeted for 2027, a significant milestone in India's efforts to build a homegrown semiconductor ecosystem, closely aligned with the Government of India’s Digital India and Atmanirbhar Bharat initiatives.

"This is a defining decade for India's semiconductor story, as we move from technology consumption to technology creation," said Sridharan Mani, Founder and CEO, Aheesa Digital Innovations. "At Aheesa, we dream beyond boundaries — building the capabilities, scale and industry that will shape India's semiconductor future. It is our vision to see Indian-designed chips serving both domestic and global markets. The partnership with Zigma brings together two companies with complementary strengths and a shared ambition for a Viksit Bharat."

For close to three decades, The Zigma Technologies India (P) Limited has been a trusted partner to government departments, OEMs and ODMs across India, turning technology into working infrastructure at national scale. Its work spans software, IT infrastructure, hardware and e-governance, alongside its own platforms and products, the foundation on which it now helps bring indigenous silicon to market.

"Zigma has worked at the intersection of technology and public infrastructure, building the systems that carry India's digital services to its people," said Raja Kathiravan, Managing Director, The Zigma Technologies India (P) Limited. "Indigenous silicon is the natural next layer of that infrastructure. In VIHAAN-I, we saw a homegrown broadband chip we could take straight into the systems we help build and in Aheesa, a partner who shares our conviction about what Indian engineering can achieve. Together, we intend to put Indian silicon at the heart of the country's digital backbone."

Aheesa's work spans indigenous semiconductor and networking technologies across telecom, broadband, cybersecurity and edge computing. This partnership now reflects the wider momentum in India's semiconductor design ecosystem, now scaling under Semicon 2.0 — the ₹1,27,500 crore programme approved in July 2026 to build a globally competitive supply chain across chip design, manufacturing, packaging and materials. As indigenous designs move from validation towards commercial adoption, it is partnerships like this, pairing Indian chip design with the reach to deploy it, that will help define how homegrown silicon scales.

VIHAAN: India’s Homegrown Broadband Chip Tapes Out for 2027 Production

VIHAAN: India’s Homegrown Broadband Chip Tapes Out for 2027 Production
VIHAAN Chip (Image ~ www.aheesa.com) 

Chennai-based Aheesa Digital Innovations has achieved first-pass silicon success with its indigenous broadband networking chip ‘VIHAAN’, built using India’s VEGA microprocessor. The milestone, backed by the Design Linked Incentive (DLI) Scheme, positions VIHAAN for production tape-out in 2027 and strengthens India’s domestic semiconductor ecosystem.

The Design Linked Incentive (DLI) Scheme is empowering Indian startups to design semiconductors for diverse strategic and commercial uses. Applications span satellite communications, drones, surveillance systems, defence and aerospace platforms, automotive electronics, IoT devices, LED drivers, AI solutions, telecom infrastructure, and smart meters.

Aheesa Digital Innovations, an Indian fabless semiconductor startup, develops chips for broadband networking and security. Its flagship SoC ‘VIHAAN’, purpose‑built for fibre broadband, was taped out on Republic Day and achieved first‑pass silicon success on Independence Day 2026. The chip now advances toward production tape‑out, targeted for 2027.

Key Highlights

  • Startup: Aheesa Digital Innovations (Chennai-based, fabless semiconductor firm)
  • Chip: VIHAAN – broadband networking System-on-Chip (SoC)
  • Processor Core: Built on VEGA microprocessor (RISC-V architecture, developed by C-DAC under MeitY)
  • Milestone: Taped out on Republic Day 2026, achieved first-pass silicon success on Independence Day 2026
  • Target: Production tape-out scheduled for 2027
  • Funding: Raised ₹40 crore earlier in 2026 from TNIFMC via TNESSF and private investors
  • Applications: Designed for fiber broadband networks, enabling last-mile connectivity for homes and offices

Technical & Strategic Significance

FeatureDetails
ArchitectureRISC-V based VEGA processor core
Process Node28nm broadband networking SoC
FunctionsIntegrates compute, broadband access, and system control
Target UseOptical fiber access networks, telecom operators
Strategic ValueReduces reliance on foreign chip designs; supports Atmanirbhar Bharat goals
Ecosystem ImpactPart of >30 chip tape-outs under DLI Scheme; contributes to India’s $100M+ VC-backed semiconductor design growth

Broader Context

  • DLI Scheme Impact: Over 30 chip design tape-outs achieved across foundries; startups raised $100M+ venture capital
  • Government Support: Chip-design tools provided to 455 organizations (350 academic institutions + 105 startups)
  • C2S Programme: 245 chip designs taped out by 71 academic institutions, building skilled manpower for India’s semiconductor future

Challenges & Trade-offs

  • Production Timeline: Commercial rollout only expected post-2027, leaving a gap before market adoption
  • Global Competition: Competing against established players (ARM, Intel, Broadcom) with mature ecosystems
  • Scaling Risks: Transition from prototype to mass production requires robust fabrication partnerships and supply chain resilience

Takeaway

The VIHAAN chip marks a strategic leap for India’s semiconductor ambitions. By combining indigenous design (VEGA) with government-backed funding (DLI Scheme), Aheesa Digital Innovations is helping India reduce dependence on foreign chipmakers and strengthen its digital infrastructure for broadband and 5G expansion.

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