India’s L&T Semiconductor Joins imec to Drive Global Automotive Chiplet Innovation

L&T Semiconductor Technologies (LTSCT), a wholly owned subsidiary of Larsen & Toubro, has officially joined imec’s global Automotive Chiplet Program (ACP), marking India’s entry into a cutting-edge semiconductor collaboration focused on modular chiplet architectures for next-generation vehicles.

Key Highlights of the Collaboration

• Program: imec’s Automotive Chiplet Program (ACP)
• Objective: Develop chiplet-based architectures and advanced packaging technologies for automotive electronics.
• Focus Areas:
  • Safety-critical computing
  • High-speed die-to-die connectivity
  • Robust testing and monitoring across the semiconductor lifecycle
• Leadership: Dr. Sandeep Kumar, CEO of LTSCT, emphasized chiplets as a fundamental shift in automotive system integration.

Why Chiplets Matter for Automotive

Traditional monolithic SoCs (System-on-Chips) are struggling to meet the demands of:

• ADAS (Advanced Driver Assistance Systems)
• Software-defined vehicles (SDVs)
• Next-gen infotainment systems

Chiplets—modular silicon blocks optimized for specific functions—integrated via 2.5D and 3D packaging offer:

• Higher compute performance per watt
• Faster time-to-market
• Greater supply chain resilience
• Scalability and cost efficiency

Strategic Importance for India

• Global Positioning: Strengthens India’s role in the semiconductor ecosystem under the India Semiconductor Mission.
• Standardization Role: Contributes to reference architectures and interoperability standards.
• Industry Impact: Positions India as a contributor to global automotive semiconductor innovation.

Comparative Context

Factor	Traditional SoC	Chiplet-Based Design
Integration	Monolithic, single die	Modular, multiple dies
Performance Scaling	Limited by die size	Flexible, scalable per function
Supply Chain	Vendor-dependent	Multi-vendor interoperability
Cost Efficiency	High for advanced nodes	Lower via modular reuse
Reliability	Challenged in SDVs	Enhanced with safety partitions

Risks & Challenges

• Standardization: Success depends on industry-wide alignment around interoperable chiplet standards.Cost & p: Developing chiplet ecosystems independently is prohibitively expensive.
• Technology Transfer: Effective collaboration between imec, LTSCT, and global partners is critical.

L&T Semiconductor Technologies’ entry into imec’s Automotive Chiplet Program is a landmark step for India’s semiconductor ambitions, positioning the country as a contributor to global automotive innovation while advancing modular, scalable chiplet architectures for future vehicles.

The core purpose of imec’s Automotive Chiplet Program (ACP) is to accelerate the transition from traditional monolithic system‑on‑chips to modular chiplet architectures in vehicles. It is designed to create standardized reference designs, interoperability frameworks, and reliability models that allow multiple vendors to contribute chiplets which can be seamlessly integrated into automotive systems. By doing so, ACP reduces development costs, shortens time‑to‑market, and ensures that advanced computing platforms for cars—covering safety, connectivity, and infotainment—can scale efficiently while meeting stringent automotive reliability standards.

In essence, ACP is about building a collaborative ecosystem where automakers, semiconductor firms, and technology providers co‑develop the foundation for software‑defined, high‑performance vehicles powered by chiplets rather than single, monolithic chips.

In essence, ACP is about building a collaborative ecosystem where automakers, semiconductor firms, and technology providers co‑develop the foundation for software‑defined, high‑performance vehicles powered by chiplets rather than single, monolithic chips.

India Joins Global Automotive Semiconductor Supply Chain with Qualcomm–Tata Partnership

Qualcomm Technologies and Tata Electronics have announced a strategic partnership to manufacture Qualcomm Automotive Modules in India. Qualcomm Automotive Modules are system-in-package solutions designed to power next-generation vehicles with advanced digital and connected features.

With Qualcomm partnering Tata Electronics to manufacture these modules in Assam, India is stepping into the global automotive semiconductor supply chain, strengthening local capabilities and aligning with the “Make in India” initiative. This collaboration is significant for several reasons:

Key Highlights

• Manufacturing Location: Production will take place at Tata Electronics’ upcoming outsourced semiconductor assembly and test (OSAT) facility in Jagiroad, Assam.
• Scope of Modules: These modules will support advanced automotive technologies such as digital cockpits, infotainment systems, connectivity solutions, and intelligent vehicle systems.
• Global Integration: Tata Electronics will join Qualcomm’s global network of module manufacturing partners, strengthening India’s role in the global semiconductor supply chain.
• Economic Impact: The partnership aligns with India’s “Make in India” initiative, boosting domestic semiconductor capabilities and enhancing supply chain resilience.
• Investment Scale: Tata’s Assam facility is a $3 billion project, designed for high-volume production to serve both Indian and international automakers.

Why It Matters

• For India: This marks a major step in building a local semiconductor ecosystem, reducing reliance on imports, and positioning India as a hub for automotive electronics.
• For Automakers: Local production means faster supply, reduced costs, and greater resilience against global disruptions.
• For Qualcomm: Expanding manufacturing partnerships diversifies its supply chain and strengthens its presence in emerging markets.

Qualcomm Automotive Modules vs Traditional Automotive Electronics

Below is a clear comparison table showing how Qualcomm Automotive Modules stack up against traditional automotive electronics (ECUs and standalone chips):

Feature / Aspect	Qualcomm Automotive Modules	Traditional Automotive Electronics (ECUs / Standalone Chips)
Integration	Highly integrated system-in-package combining compute, connectivity, and software	Separate ECUs and chips for each function (engine, infotainment, safety, etc.)
Scalability	Scalable across multiple vehicle models and segments	Limited scalability; each ECU is often custom-designed for a specific function
Connectivity	Built-in support for 5G, Wi-Fi, Bluetooth, and V2X	Connectivity requires additional modules or separate chips
Software Updates	Supports over-the-air (OTA) updates for new features and security	Updates often require physical servicing or firmware reflashing
Development Speed	Faster time-to-market with turnkey modular solutions	Longer development cycles due to fragmented hardware and software integration
Cost Efficiency	Reduces overall system cost by consolidating functions	Higher costs from multiple ECUs and redundant hardware
User Experience	Enables advanced digital cockpits, immersive infotainment, and seamless connectivity	Limited to basic infotainment and control functions
Global Supply Chain Role	Part of Qualcomm’s global manufacturing network (e.g., Tata Electronics in India)	Traditionally localized or fragmented supply chains

Key Takeaway

Qualcomm Automotive Modules represent a next-gen, software-defined vehicle approach, consolidating multiple functions into a single scalable platform. Traditional ECUs and standalone chips remain functional but are less efficient, slower to update, and more costly to integrate across modern vehicles.

Qualcomm and Tata Elxsi Partner to Accelerate Cloud‑Native Automotive Innovation

Tata Elxsi has partnered with Qualcomm to accelerate the development of Software-Defined Vehicles (SDVs) by leveraging Qualcomm’s Snapdragon Digital Chassis™ and cloud-native platforms. This collaboration focuses on creating virtual ECUs and system-on-chips (VSoCs) to enable faster, more flexible automotive software innovation.

What This Partnership Means

• Core Collaboration: Tata Elxsi will use Qualcomm’s Snapdragon Ride Flex SoC and Digital Chassis solutions to build cloud-native, virtualized automotive platforms.
• Virtual ECUs: Tata Elxsi is developing virtual ECU platforms for automakers and Tier-1 suppliers, allowing them to test and deploy software faster without relying solely on physical hardware.
• Demonstration at CES 2025: Tata Elxsi showcased its AVENIR™ SDV suite integrated with Qualcomm’s Snapdragon Ride Flex SoC.
• Target Segments: Streamlining SDV development across passenger, commercial, and off-highway vehicles.

Why It’s Important

• Shift to SDVs: Cars move from hardware-defined to software-driven, enabling updates and personalization.
• Cloud-Native Approach: Virtualization accelerates prototyping, reduces costs, and improves reliability.
• Future Mobility: Positions Tata Elxsi and Qualcomm at the forefront of next-gen mobility solutions.

Comparison: Traditional vs. Software-Defined Vehicle Development

Aspect	Traditional Vehicle Development	Software-Defined Vehicle Development (SDV)
Hardware Dependence	Functions tied to physical ECUs	Functions virtualized, cloud-native
Update Cycle	Slow, requires hardware changes	Fast, OTA (over-the-air) updates
Flexibility	Limited customization	Highly customizable, modular
Cost Efficiency	High due to hardware reliance	Lower via virtualization and cloud testing
Innovation Speed	Years-long cycles	Rapid prototyping and deployment

Challenges & Risks

• Integration Complexity: Automakers must adapt legacy systems to cloud-native platforms.
• Cybersecurity Concerns: SDVs increase exposure to vulnerabilities and hacking risks.
• Standardization Needs: Industry-wide standards for virtual ECUs are still evolving.

Strategic Outlook

This partnership is a strategic leap for Tata Elxsi, positioning it as a key player in the global SDV ecosystem. For Qualcomm, it strengthens the role of Snapdragon Digital Chassis™ as the backbone of connected, intelligent vehicles. Together, they are setting the stage for faster innovation cycles, safer mobility, and more personalized driving experiences.

TCS Powers Ahead in Software-Defined Vehicles with European Expansion

Tata Consultancy Services (TCS) has taken a strategic leap in the global automotive software arena by announcing the launch of three new hubs in Europe, dedicated to advancing Software-Defined Vehicle (SDV) innovation.

The new footprint includes two Automotive Delivery Centres in Germany—Munich and Villingen-Schwenningen—and an Engineering Centre in Romania. These hubs are designed to support leading European original equipment manufacturers (OEMs) in building next-generation mobility solutions.

TCS is focusing on technologies like autonomous driving, intelligent infotainment systems, connected vehicle ecosystems, and digital cockpit design. The Romanian centre will concentrate on early-stage SDV platform development, while the German hubs will offer close-proximity support to European automotive partners.

A highlight of this initiative is the integration of Generative AI to dramatically accelerate vehicle software development. GenAI tools will automate requirement gathering, feature coding, testing, and simulation—reducing cycle times and enabling rapid over-the-air (OTA) updates.

TCS’s GenAI capabilities are also enabling hyper-personalization, creating in-car experiences that adapt to driver preferences and behaviors. Engineers can now simulate millions of driving scenarios virtually, boosting validation and safety for semi- and fully-autonomous features.

With over 100 engineers already stationed across these new centres and a global talent pool of 2,000+ SDV experts, TCS aims to redefine how vehicles evolve post-sale—from fixed mechanical products to software-first platforms.

Notably, this signals a major vote of confidence in India's engineering talent and its exportable innovation prowess. It also opens up opportunities for domestic automakers to integrate advanced software systems, bringing global expertise back to India’s rapidly growing electric and autonomous vehicle ecosystem.

Tata Technologies Launches Recruitment Drive for 100+ Cloud and Data Engineers to Revolutionize Software-Defined Vehicles

Tata Technologies, a global leader in engineering and R&D services, is launching a recruitment drive to onboard over 100 skilled Cloud and Data Engineers. These professionals will play a pivotal role in driving innovation for the next generation of Software-Defined Vehicles (SDVs), transforming the automotive landscape with cutting-edge software solutions.

As a leading global engineering and R&D services provider, Tata Technologies is committed to advancing automotive technology. The company invites talented professionals to join its mission of transforming the automotive landscape. They will play a key role in designing and developing advanced software capabilities that will enhance future driving experiences.

The company is looking for candidates with at least 5 years of experience in domains such as Teamcenter, Python, Microservices, and Pyspark. Open positions include roles for Cloud Engineers, Data Engineers, and Solution Architects. Position is available in Chennai.

The organization offers a vibrant work environment and the opportunity to contribute to the revolutionary shift towards software-defined vehicles. This is an excellent opportunity to be part of a pioneering team dedicated to engineering a better future.

Apply now to be a part of the revolution: https://lnkd.in/d_msvCXJ

BMW and Tata Technologies Launch New JV 'BMW TechWorks India'

BMW Group and Tata Technologies have launched a new Joint Venture (JV) — BMW TechWorks India. This new global hub is focused on Al, automotive software, and business processes.

BMW Group and Tata Technologies each hold a 50% share in this joint venture. The JV will have offices in strategic talent hubs in Pune, Bengaluru, and Chennai.

The Joint Venture (JV) will innovate automotive software, including software-defined vehicles (SDV) and digital transformation solutions for business IT.

The newly formed organisation will leverage resources from BMW Group’s India and Munich operations as well as Tata Technologies, TCS and Tata Elxsi to not only develop software and new innovations for in-car systems, but also manage business and manufacturing processes for BMW Group across the world.

BMW TechWorks India will work on software-defined vehicles (SDV), automated driving, Al applications, next-gen infotainment systems, and business IT solutions.

The joint venture will start with 100 employees and rapidly scale to a four-digit workforce by the end of 2025. This collaboration aims to drive digital innovation in the automotive industry and strengthen BMW's global strategy by leveraging top-tier Indian talent.

India’s exceptional engineering and IT talent will play a pivotal role in developing strategic software solutions for SDVs, automated driving, digital infotainment, and automotive digital services. In addition to automotive software, the joint venture will provide digital innovations for the BMW Group’s Business IT.

Consequently, BMW TechWorks India will expedite the digital transformation of the car manufacturer’s global production network as well as strengthen its digital customer journey and sales processes. Another key area of focus will be the development of AI applications and platforms, which will increase the speed and efficiency of all core business processes.

The management team of BMW TechWorks India is comprised of seasoned executives from both partner companies. Representing Tata Technologies are Aditya Khera as CEO and Sweta Girinatham as CFO of this JV. From the BMW Group, Stefan Flader serves as COO of Enterprise IT, and Oliver Scheickl holds the position of COO of Automotive Software in this new JV.

Apart from the recent joint venture with Tata Technologies, BMW has engaged in several other collaborations with Indian companies. BMW and an another Tata Group company, Tata Motors, have a long-standing partnership, including the production of the BMW X1 and BMW X3 models in India.

BMW and Bajaj Auto have collaborated on the development of the BMW K1600 B motorcycle, which is designed and manufactured in India.

BMW has also partnered with Mahindra & Mahindra for various projects, including the development of electric vehicles and mobility solutions.

TCS Launches New IoT Engineering Lab in Ohio

• The lab will carry the full suite of TCS’ IoT solutions including TCS Clever EnergyTM, TCS DMPTM, and TCS DigifleetTM, and industry solutions for the manufacturing, energy, consumer, and life sciences sectors
• The lab will also support the local community to embrace sustainability with TCS Grow+, a smart gardening technology that has helped harvest over 3,500 pounds of fruits and vegetables, benefitting 500+ families

Tata Consultancy Services (TCS) (BSE: 532540, NSE: TCS), a global leader in IT services, consulting, and business solutions, has launched the Bringing Life to Things™ Lab in Cincinnati, Ohio. The lab is designed to support the rapid prototyping, experimentation, and large-scale implementation of AI, GenAI, and IoT engineering solutions, enabling TCS to assist clients in bringing innovative solutions to life faster and more efficiently.

Spanning across 3,000-square feet, this lab will advance the deployment of TCS’ comprehensive suite of IoT solutions, including TCS Clever EnergyTM, TCS Digital Manufacturing PlatformTM (DMP) and TCS DigifleetTM, among others. These solutions cater to various industries including health care and life sciences, manufacturing, energy and resources, consumer packaged goods, and more. The lab will also help businesses collaborate and co-innovate, integrating physical assets, partner technologies, and customer challenges to create new offerings and solutions.

Amit Bajaj, President-North America, TCS, said, “On the demand side, structural shifts such as energy transition, supply chain relocation and AI are requiring significant new production capacity in the United States that is connected, intelligent and autonomous by design. On the supply side, Intelligent Edge, powered by advances in connectivity, sensor and AI technology, is reinventing customer experience, personalized products and connected manufacturing. TCS’ investment in the Bringing Life to Things Lab in Ohio will help our clients bridge the traditional divide between operational and digital technology by rapidly turning their ideas into minimum viable products that reimagine their value chain at scale. With its strategic location in Cincinnati, home of TCS’ largest American delivery center, the lab is well positioned to tap into the area’s tech talent to help our customers across North America.”

Regu Ayyaswamy, Global Head of the Internet of Things (IoT) and Digital Engineering, Tata Consultancy Services, said, “With the inauguration of the Bringing Life to Things Lab, TCS reaffirms its commitment to driving innovation and digital excellence in an era defined by Artificial Intelligence and GenAI. This lab will spark co-innovation, enabling clients to brainstorm and collaborate through design thinking workshops, and unlock the full potential of IoT, AI, and GenAI technologies.”

The lab also offers TCS’ innovative solutions, including the TCS Neural Manufacturing solution, which provides autonomous and intelligent capabilities for factories, and the TCS connected healthcare platform, providing solutions for personalized medicine. Some key TCS initiatives that are anchored at the Bringing Life to Things Lab include:

1. Digital Twin of the Heart: TCS announced the creation of the first-ever digital heart of a professional runner in 2023, unveiling a virtual replica of Boston Marathon champion and two-time Olympian Des Linden’s heart. Through this partnership, TCS aims to demonstrate how AI-powered digital twin technology can transform athlete training by measuring and monitoring the heart’s performance in real time. Beyond athletics, this technology has the potential to transform healthcare. In concert with wearable devices and sensors, it can gather and deploy patient data to perform real-time analyses, preventing the development or progression of medical conditions.
2. Building Software-Defined Vehicles: IoT technology is at the heart of digital transformation in the automotive sector. TCS helps automakers and OEMs navigate and accelerate their journey toward building Software-Defined Vehicles (SDVs). The TCS Auto Gen AI Suite at the Bringing Life to Things Lab expedites the design, development, and validation of SDVs, leveraging GenAI and object detection to track people, vehicles, and other hazards in a car’s path.

In addition to serving clients, the lab engages with the local community through TCS’ smart gardening technology, TCS Grow+. Over 50 employees collaborated to develop a 3,500 square foot smart garden, leveraging sensor fusion based IoT technology to monitor plant environments, optimizing growth conditions like watering. Since its inception, TCS has harvested over 3,500 pounds of fruit and vegetables, benefitting more than 500 families through various charitable organizations.

Aligned with TCS' flagship digital innovation and career readiness program, goIT (go Innovate Together), the Lab also serves as a hub for researching, designing, and testing emerging learning concepts with experts in the field before taking them into classrooms all over the world. The opening of this lab underscores TCS’ strong presence in the U.S., where it has a 50-year legacy of driving growth and transforming the businesses of leading companies in every sector.

Intel is Teaming Up with Chinese Tech Co.s to Develop Innovative Solutions for Intelligent Cockpits in Vehicles

Intel Corporation has announced a collaboration with two of China's technology companies — Neusoft and ThunderSoft — to develop innovative solutions for the next generation of intelligent cockpits in vehicles. This collaboration will leverage Intel's AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC) to create advanced cockpit designs that offer AI customization and can scale across different vehicle generations.

The partnership aims to integrate Intel's compute platform into intelligent cockpit systems that will enhance driving experiences with a focus on comfort and safety. The Intel SDV SoC will support features like multiple screen sizes, multimodal interaction, 3D user interfaces, augmented reality navigation, and driver and occupant monitoring. It's designed to enable offline deployment of large models within the vehicle, addressing the increasing demand for privacy and a low-latency experience.

The collaboration will impact automotive market with new developments in AI & privacy by providing ability to deploy large Al models offline within the vehicle addresses the increasing demand for privacy and a low-latency experience. This ensures that users' data is processed within the vehicle, enhancing data privacy protection while still benefiting from Al's capabilities.

ThunderSoft's platform, in particular, will support multiple high-definition screens capable of simultaneous 3D rendering, providing a PC-quality gaming experience for vehicle occupants. The integration of AI large language models on Intel solutions will also allow for faster response times and more seamless interactions with the vehicle, all while ensuring enhanced data privacy protection.

This collaboration is a significant step for Intel in strengthening its automotive ecosystem and supporting automakers in creating cutting-edge in-vehicle experiences. It's exciting to see how this partnership will contribute to the evolution of software-defined vehicles and the automotive industry as a whole.

Intel’s efforts in China, the world's largest auto market, offer a massive testing ground for the next-gen intelligent and software-defined vehicle technologies. Intel’s open architecture is providing the flexible foundation electric vehicle disruptors are seeking to centralize more functions in modern electric vehicles at scale and across generations of vehicle models – from entry level to luxury.