
Prime Minister Narendra Modi has laid the foundation stone for India Chip Pvt. Ltd., a ₹3,700 crore semiconductor facility being developed in Jewar, Greater Noida by a joint venture between HCL Group (60%) and Foxconn (40%). The plant will function as an Outsourced Semiconductor Assembly and Test (OSAT) facility, with a planned capacity to process 20,000 wafers per month. It is expected to be operational by 2028.
Key Highlights
- Investment: ₹3,700 crore
- Partnership: HCL Group (India) and Foxconn (Taiwan)
- Location: Yamuna Expressway Industrial Development Authority (YEIDA), Jewar, Greater Noida
- Timeline: Operational by 2028
- Capacity: 20,000 wafers/month
- Jobs: Estimated 3,500 new employment opportunities
Strategic Importance
- Strengthens India’s semiconductor ecosystem and reduces dependence on imports
- Supports the government’s “Techade” vision of technological self-reliance
- Positions India as a competitive player in the global chip supply chain
Notably, the distinction between an OSAT facility and a semiconductor fabrication plant (fab) is central to understanding India’s chip strategy.
| Aspect | OSAT (Outsourced Semiconductor Assembly & Test) | Fab (Fabrication Plant) |
|---|---|---|
| Role in supply chain | Handles post-fabrication processes: cutting wafers into chips, packaging, assembly, and testing | Manufactures chips from raw silicon wafers using advanced processes like lithography, etching, deposition |
| Complexity | Less capital-intensive; focuses on packaging and quality assurance | Extremely complex; requires cleanrooms, precision tools, and multi-billion-dollar investments |
| Investment scale | Hundreds of millions of dollars (e.g., India’s ₹3,700 crore plant) | Tens of billions of dollars (TSMC, Intel fabs often exceed $10–20B) |
| Technology focus | Ensures chips meet specifications, reliability, and performance standards | Actually creates the semiconductor devices (transistors, circuits) |
| Strategic value | Builds ecosystem resilience, supports fabless companies, and reduces dependency on foreign packaging/testing | Core of semiconductor sovereignty — enables full control of chip design and production |
| Examples | ASE Group, Amkor, JCET | TSMC (Taiwan), Samsung (Korea), Intel (US) |
In short: OSAT = finishing school for chips; Fab = birthplace of chips. India is starting with OSAT to build capacity before attempting full-scale fabs.









"The HCL Microsoft Business Unit is the next phase to bolster HCL's successful and long-standing relationship with Microsoft. Increasingly, customers are making bold strides, incorporating IoT solutions with machine learning for analytics, running this solution in the public cloud and supported by CRM. This business unit combines HCL's specialized services and global reach with Microsoft's powerful cloud and business technologies, making a strong and unique offering for clients. These offerings are coming at a critical time when enterprises are aggressively implementing digital technologies for competitive advantage," said Kalyan Kumar, Corporate Vice President and Global CTO of HCL Technologies.
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