Intel, 3DGS and Odisha Ink Landmark MoU for India’s Ist Advanced Glass Substrate Facility

Intel, 3DGS Inc. USA, and the Government of Odisha have signed a landmark $3.3 billion MoU to establish India’s first advanced semiconductor glass substrate manufacturing facility in Bhubaneswar–Khurda, positioning Odisha as a global hub for semiconductor technology. The project will generate over 1,800 direct high-skilled jobs and thousands of indirect opportunities.

Glass substrate is a thin, engineered sheet of glass that acts as the base layer on which circuits and chiplets are built.

Semiconductor glass substrate manufacturing technology refers to the use of ultra‑flat, engineered glass panels as the foundational layer (substrate) in advanced chip packaging. Unlike traditional organic laminates or silicon interposers, glass substrates offer superior electrical, thermal, and mechanical properties, enabling faster, more reliable, and denser semiconductor integration.

Key Highlights of the MoU

• Partnership: Signed between the Government of Odisha, Intel Corporation, and 3D Glass Solutions (3DGS) Inc. USA.
• Investment: Estimated at USD 3.3 billion (₹31,600 crore), one of India’s largest high-tech manufacturing investments.
• Location: Facility to be set up in the Bhubaneswar–Khurda region.
• Employment: Over 1,800 direct high-skilled jobs plus significant indirect employment in allied industries.
• Timeline: Implementation in phases over 5–6 years.

Strategic Importance

• Semiconductor Ecosystem Growth: The facility will produce advanced packaging glass core substrates and high-density interconnect substrates, critical for AI, high-performance computing, and next-gen electronics.
• Intel’s Role: Intel will provide technology know-how, process expertise, licensing, and workforce capability building.
• Government Vision: Union Minister Ashwini Vaishnaw emphasized that this MoU aligns with the India Semiconductor Mission, complementing recent partnerships with Applied Materials, Lam Research, Tokyo Electron, Merck Electronics, Tata Electronics, and ASML.

Intel's Involvement 

Intel is deeply involved in semiconductor glass substrate manufacturing as both a technology pioneer and ecosystem enabler. After more than a decade of R&D, Intel unveiled industry‑leading glass substrates in 2023, positioning them as the next leap in advanced packaging for AI, data centers, and high‑performance computing.

In MoU with Odisha, Intel is providing process expertise, design knowledge, and advanced packaging capabilities to enable the Odisha facility to manufacture glass core substrates and high‑density interconnect substrates.

In 2023, Intel announced one of the industry’s first glass substrates, enabling 10x higher interconnect density compared to organic substrates.

Glass Substrate

3DGS Involvement

3D Glass Solutions (3DGS) is the specialist technology partner in semiconductor glass substrate manufacturing. 3DGS involvement is central because it is one of the very few companies worldwide with proprietary expertise in glass core substrates and through‑glass via (TGV) technology.

3DGS is the materials backbone of this partnership. While Intel provides process scaling and ecosystem integration, 3DGS contributes the specialized substrate technology that makes advanced glass packaging possible. Together, they enable India to leapfrog into the future of semiconductor manufacturing.

Economic & Industrial Impact

• Boost to Odisha’s Economy: The project is expected to catalyze Odisha’s industrial growth, supporting its target of becoming a $500 billion economy by 2036 and $1.5 trillion by 2047.
• Cluster Development: Will attract global players, drive cluster-based industrialisation, and strengthen upstream (materials, chemicals, equipment) and downstream (electronics manufacturing, exports) sectors.
• Export Orientation: Facility will contribute to export-oriented manufacturing, enhancing India’s role in the global semiconductor supply chain.

Technical Significance

• Semiconductor Substrates: These are the base layers on which circuits are built, essential for chip performance, power efficiency, and signal transmission.
• Advanced Packaging: Glass core substrates prevent warping and enable multi-chip architectures like AI processors, while HDI substrates allow faster communication between complex chips.

Conclusion

This MoU represents a transformative milestone for India’s semiconductor ambitions. By combining Intel’s global expertise with Odisha’s industrial vision, the project will strengthen India’s domestic semiconductor ecosystem and position Odisha as a strategic global hub for advanced packaging technologies.