Vertiv Marks AI Infrastructure Milestone with India’s First Direct‑to‑Chip Liquid Cooling Deployment

Secondary Fluid Network (SFN) skid design, engineering & manufacturing capability, and rigorous quality standards support Vertiv India's growing role in the country's liquid cooling market

Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, has successfully delivered India’s first direct-to-chip high-density liquid cooling (HDLC) deployment in collaboration with CapitaLand India Trust (CLINT), Asia’s first India-focused property trust under CapitaLand Investment (CLI), at the CLDC Mumbai 01 Data Center in Airoli, Navi Mumbai. The project leverages Vertiv’s secondary fluid network (SFN) system to support 30 MW of AI workloads for a hyperscale end customer, marking a significant milestone for India’s data centre industry as it moves to liquid cooling to meet the demands of AI infrastructure.

Liquid-based cooling is the fastest-growing segment, accelerating as operators move beyond traditional air cooling to meet the demands of AI-driven, high-density workloads. Central to enabling liquid-based cooling adoption at scale, the closed loop SFN system carries coolant from a facility's cooling infrastructure to the chip level, and is manufactured, tested and commissioned to exacting standards before it can support live IT loads.

“The CapitaLand Investment project, particularly the collaboration, helped us accelerate the development of our manufacturing and engineering capabilities, enabling us to support the growing demands of AI-ready digital infrastructure,” said Vertiv India Managing Director Subhasis Majumdar. “As the Indian market advances toward high-density liquid cooling for hyperscale and data center applications, we see meaningful growth potential and are well positioned to deliver the scale, expertise, and innovation required for these deployments.”

From innovation to India’s first HDLC data center deployment

To meet the scale of the HDLC project, Vertiv built a production facility capable of mass-manufacturing the customized technology loop skids designed to support future large-scale deployments. The facility was also designed to meet stringent standards for protecting sensitive cooling components from contamination.

Vertiv worked closely with CapitaLand Investment, owner and operator of CLDC Mumbai, to develop installation and commissioning (I&C) procedures designed to minimize dust ingress into the technology loop as the SFN skids were installed. Following commissioning, Vertiv demonstrated technology-loop balancing using its innovative SFN-Tab kits, then carried out comprehensive Level 4 (L4) testing at the data centre to validate performance ahead of go-live.

Building Vertiv India’s capability for large-scale liquid cooling

The completion of this project further demonstrates Vertiv’s expertise in developing gigawatt-scale AI infrastructure. It also builds on the relationship between Vertiv and CapitaLand Investment, with both organizations working closely from design through commissioning to bring one of India’s first HDLC facilities to life.

For more information on Vertiv’s leading portfolio of power and thermal management, infrastructure solutions, IT systems, and services for critical digital applications, visit Vertiv.com.

Vertiv Expands Global Manufacturing Capacity for AI-Ready Data Center Cooling Solutions

• Expansions at the company's Tognana, Italy, technology campus support growing worldwide demand for advanced thermal infrastructure and strengthen Vertiv's cooling innovation capabilities

Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, announced investments at its Tognana campus near Padua, Italy, to expand manufacturing and integrated testing capabilities for data center cooling systems. The company expects the investments to double chiller production capacity in the region by the end of 2026 and plans to complete a new large-scale testing laboratory in early 2027, supporting growing demand for AI and high-density computing infrastructure.

The new laboratory will enable testing of large-scale chillers and validate their integration with liquid cooling systems under high-density load conditions and extreme temperature ranges. The expanded capability is intended to help customers validate thermal performance under expected site conditions and deploy increasingly complex cooling systems with greater speed and confidence.

Vertiv expects to double regional chiller manufacturing capacity with the expansion of its Tognana, Italy facility

"AI is driving thermal demands that didn't exist two years ago, with higher densities, faster deployment demands, and no room to compromise on reliability," said Gio Albertazzi, CEO of Vertiv. "The expansion at Tognana puts us further ahead with more manufacturing capacity, integrated testing, and advanced thermal management systems built for current and future generations of silicon. This investment reinforces our position at the front of the curve."

The campus serves as one of Vertiv's principal centers for cooling technology development, integrating research and development, product management, manufacturing, testing, and customer engagement. The site includes a Customer Experience Center where customers and consultants can participate in witness testing of a broad range of cooling technologies across the thermal chain under real-world operating conditions.

For more information on Vertiv’s leading portfolio of power and thermal management, infrastructure solutions, IT systems, and services for critical digital applications, visit Vertiv.com.