TCS Wins ₹122 Cr Odisha Bid to Build AI‑Enabled Governance Platform

Tata Consultancy Services (TCS) has secured a ₹122.6 crore contract to implement OSWAS 3.0, an AI-enabled digital governance platform for the Odisha Government, marking a major leap in paperless administration and transparent governance.

First launched in 2009, OSWAS (Odisha State Workflow Automation System) is the Government of Odisha’s flagship e‑governance platform, designed to digitize administrative processes, enable paperless workflows, and deliver faster, transparent governance across the state.

Built on TCS DigiBOLT™, the new OSWAS 3.0 platform will unify workflow automation, system integration, advanced analytics, robust security, and AI-driven features within a single digital framework.

Key Highlights of the Deal

• Contract Value: ₹122.6 crore
• Project: Odisha State Workflow Automation System (OSWAS) 3.0
• Duration: Extended partnership for ~6 years
• Technology Backbone: Powered by TCS DigiBOLT™, integrating workflow automation, AI, analytics, and security
• Scope: Supports 4,600+ government offices and nearly 50,000 users statewide

Evolution of OSWAS

• OSWAS 1.0 (2009): Digitized file processing and correspondence within the Odisha Secretariat
• OSWAS 2.0 (2018): Technology refresh, stronger infrastructure, and rollout across districts and corporations
• OSWAS 3.0 (2026): Introduces microservices-based architecture, AI-enabled capabilities, mobile-first design, and Odia language support for wider accessibility

Benefits of OSWAS 3.0

• Unified Digital Workplace: Enables digital file movement, electronic approvals, and real-time tracking
• Transparency & Efficiency: Reduces manual follow-ups and accelerates decision-making
• AI Integration: Enhances governance with predictive analytics and intelligent workflows
• Accessibility: Odia language support ensures inclusivity across departments
• Security: Strengthened interoperability and web accessibility with advanced safeguards

Voices from Leadership

• Shri Vishal Kumar Dev, IAS (Govt. of Odisha): “OSWAS has evolved into the digital backbone of Odisha. OSWAS 3.0 will simplify administration, reduce friction, and enable faster, informed decision-making.”
• Sushil Jain, Head-Public Services India, TCS: “Odisha has been ahead of the curve in using technology for governance. OSWAS 3.0 will empower officials with speed, visibility, and accountability.”

TCS’s Broader Role in Governance

• Birth & Death Registration System
• Mission Shakti Women SHG Interest-Subvention
• Integrated Financial Management System
• Odisha Judicial Workflow Automation System (OJWAS)

Why This Matters

• For Citizens: Faster access to services, reduced bureaucracy, and improved transparency
• For Government: Streamlined workflows, better accountability, and scalable digital infrastructure
• For India: Strengthens the country’s sovereign AI and digital governance ecosystem, aligning with the national push for AI-driven administration

Vedanta Aluminium, V‑Spark launch MetALverse in Odisha; partners with OpenAI, Microsoft, SAP to unlock ₹2,100 crore AI‑driven value

Several MoUs to deploy deep tech solutions were announced during MetALverse, Vedanta Aluminium’s tech showcase in Jharsuguda, Odisha that featured participation from major tech leaders and emerging startups

Vedanta Aluminium, India's largest aluminium producer, in collaboration with V-Spark, India's largest manufacturing deep tech incubator, recently hosted MetALverse, an immersive tech showcase in Jharsuguda, Odisha. The company also announced partnerships with several cutting-edge technology providers, including market leaders such as OpenAI, Microsoft and SAP. Together, they will deploy innovative, multi-pronged solutions to cumulatively unlock up to ₹2,100 crore in value through the enhanced adoption of AI, digitalisation and automation technologies across Vedanta Aluminium’s operations.

Vedanta Aluminium’s MetALverse event was envisioned as a strategic platform to accelerate the deployment of breakthrough technologies across large-scale industrial operations, by bringing together global technology leaders, emerging startups, and top business experts. The partnerships will focus on evaluating, piloting and scaling next-generation solutions across Vedanta Aluminium’s operations. The value opportunity of ₹2,100 crore will be achieved through the integration of innovative solutions for enhanced plant productivity, cost optimisation, asset reliability and sustainability initiatives across Vedanta Aluminium's integrated value chain.

The event reflects a shared vision between Vedanta Aluminium and V-Spark to bridge the gap between groundbreaking deep tech innovation and real-world deployment, by identifying high-impact technologies, validating them in live operating environments and accelerating their adoption. Vedanta Aluminium has already established a fully integrated value chain that ranges from mining to alumina refining to aluminium production. By leveraging the company’s vast, cutting-edge manufacturing plants - some of which are amongst the largest in the world - as a mega incubation environment, V-Spark aims to rapidly transform promising innovations into industry-ready deployments while also co-creating a robust AI-led manufacturing ecosystem.

Priya Agarwal Hebbar, Non-Executive Director, Vedanta Limited and Chairperson, Hindustan Zinc, said "India’s manufacturing sector is entering a defining decade. The future will belong to companies that combine scale with intelligence, sustainability and the courage to rethink what is possible. At Vedanta Aluminium, we see AI as a catalyst for that transformation, with human intelligence providing the judgement and direction behind it. We are bringing together the best minds across industry and technology because we don’t want to simply make today’s plants better. We want to build the metal of the future, using the technologies of the future."

Akarsh Hebbar, Non-Executive Vice Chairman, Vedanta Aluminium and Chairman, V-Spark DeepTech Ventures, said "The greatest opportunity in industrial innovation lies in deploying new technologies at scale to create measurable business value. Vedanta Aluminium, as one of the top producers of the metal of the future globally, provides the expansive operating footprint, technical depth and determination to industrialise breakthrough solutions, while V-Spark is the engine that identifies, validates and accelerates these technologies from concept to enterprise-wide deployment. We aim to partner with several industrial solutions to scale and transform creative innovation into tangible productivity gains, stronger sustainability, enhanced reliability and significant value creation."

Pinak Dattaray, Founder & CEO, Ripik.AI, said "AI is creating new opportunities for industrial organisations to transform how knowledge is accessed, decisions are made and operations are managed. At Ripik.AI, we are focused on making advanced AI capabilities accessible through tools that help people and organisations solve complex problems and work more effectively. We are excited to collaborate with Vedanta Aluminium as it explores new applications of AI across its business. The company demonstrates how leading manufacturers can combine deep operational expertise with cutting-edge AI to unlock innovation, improve performance and create meaningful value at scale."

At MetALverse, Vedanta Aluminium announced collaborations with several top technology companies and emerging innovators to accelerate AI-led transformation across its operations. The identified partners include OpenAI for generative AI and intelligent agents; Microsoft for cloud, AI and enterprise transformation; SAP for integrated enterprise processes; AVEVA for industrial data, digital twins and advanced analytics; Rockwell Automation for smart manufacturing and control systems; Thoughtworks for digital engineering; and Fives for aluminium process technologies and carbon plant optimisation. The company has also partnered with deep-tech innovators including Ripik.AI for industrial vision and process optimisation; XYMA for high-temperature asset monitoring; Faclon for industrial intelligence and connected manufacturing; DesignX for AI-enabled factory workflows; DigitalPaani for industrial water optimisation; AutoVRse for immersive workforce training; Enmovil for AI-led logistics; and ideaForge for drone-based industrial intelligence.

These collaborations will focus on technical evaluation, data integration, pilot deployment and scale-up potential. Through its V-Spark innovation ecosystem, the company aims to rapidly validate and deploy solutions that strengthen productivity, safety, sustainability, asset reliability and operational decision-making. Presently, Vedanta Aluminium is actively collaborating with nearly 70 startups under the program, spanning one of the world’s largest alumina refineries in Lanjigarh, Odisha, the world’s largest single-location aluminium plant in Jharsuguda, Odisha, and India’s iconic aluminium producer, BALCO in Korba, Chhattisgarh.

About Vedanta Aluminium Metal Limited:

Vedanta Aluminium Metal Limited is one of the world’s leading producers of aluminium, ‘the Metal of the Future’ powering advanced manufacturing, the energy transition, and next generation technologies. As India’s largest aluminium producer, the Company operates integrated, world-class assets including a state-of-the-art alumina refinery, one of the world’s largest aluminium smelter complex in Odisha, and the iconic Bharat Aluminium Company (BALCO). With a diverse portfolio of high-quality aluminium products, Vedanta Aluminium caters to discerning customers across more than 60 countries and plays a vital role in global industrial supply chains. The company is recognised among global peers for its sustainability leadership, as reflected in its strong performance in the S&P Global Corporate Sustainability Assessment. By advancing the possibilities of aluminium - the Metal of the Future - Vedanta Aluminium continues to enable next generation industries while creating enduring value for customers, communities, and shareholders. For more information, visit: https://vedantaaluminium.com/

About V-Spark DeepTech Ventures:

V-Spark DeepTech Ventures Pvt. Ltd., Vedanta’s dedicated deep-tech and innovation arm, is accelerating technology-led transformation across the Group’s mining, metals and manufacturing businesses. Operating as a venture-client platform for all Vedanta entities, V-Spark partners closely with startups, MSMEs and global technology leaders to rapidly pilot, deploy and scale cutting-edge solutions across AI/ML, automation, robotics, drones, computer vision and advanced digital technologies. With a strong focus on operational excellence, volume-cost optimisation, reliability, sustainability and ESG integration, the platform is also enabling strategic investments in future-ready innovations. Through its robust global startup ecosystem and scalable innovation capabilities, V-Spark is positioning Vedanta at the forefront of industrial deep-tech adoption and next-generation manufacturing transformation.

Saatvik Solar Signs an MoU with the Odisha Govt to Establish a 3.6 GW Solar Cell Manufacturing Facility at Gopalpur, Ganjam

Cell & Module Manufacturing Plant Odisha, SGEL

Saatvik Solar Industries Private Limited has signed a Memorandum of Understanding (MoU) with the Industrial Promotion and Investment Corporation of Odisha Limited (IPICOL), Government of Odisha, for setting up a 3.6 GW Solar Cell Manufacturing Facility at Gopalpur in Ganjam district, Odisha.

The proposed facility marks an important step in Saatvik Solar’s plans to further expand its manufacturing capabilities in Odisha and contribute to the development of the state’s renewable energy manufacturing ecosystem. The project is also expected to create employment opportunities and support the development of the wider industrial ecosystem in the region.

The new facility will form part of Saatvik Solar’s broader manufacturing development at Gopalpur, where the company is already progressing with its Phase I integrated manufacturing facility. Phase I has achieved key construction and installation milestones and is now advancing towards commissioning. Tool installation is progressing well, with ramp-up set to commence shortly marking a significant step towards operational readiness.

Gopalpur Manufacturing Development Progresses Towards Commissioning

Saatvik Solar’s Phase I manufacturing facility at Gopalpur has made substantial progress, with major construction and infrastructure works completed and equipment installation and testing activities advancing across the facility.

Cell & Module Manufacturing Plant Odisha, SGEL

The company has also completed key power infrastructure milestones, with the dedicated 220 kV substation ready for charging. Manufacturing lines are progressing through the final stages of installation, testing, validation and process readiness, with the company moving towards the next stage of operations.

The cell line is on track for ramp-up shortly, marking a key step towards operational readiness, with the ALMM-II inspection planned for September—bringing the facility closer to full-scale commercialisation.

Commenting on the milestone, Mr. Prashant Mathur, CEO, Saatvik Green Energy Limited said, “Odisha is more than a manufacturing milestone for Saatvik; it is a statement of our ambition. As our 2.4 GW cell and 4 GW module manufacturing lines move towards production, we are taking a decisive step towards building scale, strengthening integration and creating the foundation for our next phase of robust growth. India’s clean energy opportunity is enormous, and we intend to play a defining role in it. Our ambition is to build manufacturing capabilities that are globally competitive, technologically advanced and deeply aligned with India’s journey towards energy security and self-reliance. Building on the momentum of Phase I, we are advancing plans for a further 3.6 GW Phase II expansion at Gopalpur, which will significantly scale our integrated manufacturing footprint and strengthen our ability to meet the growing demand for domestically manufactured solar products. With Phase II targeted for commercial production by FY28, we are preparing for the next leap in scale. The future we see is one where India is not only a major consumer of clean energy, but a global manufacturing powerhouse for it. Saatvik is determined to help build that future by investing in capacity, technology and excellence today and creating a stronger, more resilient and more sustainable energy ecosystem for tomorrow.”

Alongside the progress of Phase I, Saatvik Solar is advancing plans for the next phase of development at Gopalpur, which will further scale its integrated manufacturing capabilities. The Phase II 3.6 GW cell capacity expansion is being planned to support the growing demand for domestically manufactured solar products and deepen the company’s presence across the solar value chain.

The company’s phased development at Gopalpur reflects its long-term approach towards building an integrated and technologically advanced solar manufacturing ecosystem, with a focus on scale, operational excellence, quality and supply chain resilience.

HCLTech Announces AI Data Center in Bhubaneswar in Partnership with Sarvam and Govt of Odisha

Representative Image

• The investment will accelerate India’s sovereign AI and data ecosystem

Further to the announcement dated July 13, 2026, relating to its proposed entry into the full-stack AI market, HCLTech, a global technology company, today said that it plans to set-up its first AI Data Center in the upcoming Odisha Sovereign AI Park.

The AI Data Center will be established in partnership with Sarvam and the Government of Odisha. The planned capital outlay for the project will be Rs 14,257 crores, including financial assistance from the Government of Odisha.

This investment will boost India’s sovereign AI play and local developer ecosystem by leveraging HCLTech’s full-stack AI capabilities and Sarvam’s foundation models to offer sector-specific AI applications to private and public sector enterprises and address the government’s sovereignty needs. It will also contribute to delivery of multi-lingual AI based services to the last mile, in line with Hon’ble Prime Minister Sh. Narendra Modi’s clarion call of AI for the benefit of everyone.

A Memorandum of Understanding to this effect was signed between HCLTech, Government of Odisha and Sarvam in the presence of the Hon’ble Chief Minister of Odisha, Sh. Mohan Charan Majhi; Dr Mukesh Mahaling, Hon’ble Minister of Electronics and IT, Government of Odisha; Roshni Nadar Malhotra, Chairperson, HCLTech; C Vijayakumar, CEO & MD, HCLTech and Pratyush Kumar, Co-Founder of Sarvam.

Roshni Nadar Malhotra, Chairperson, HCLTech commented, “HCLTech has been a flagbearer of India’s technology industry. In line with the Digital India and Atmanirbhar Bharat vision of Hon’ble Prime Minister Sh. Narendra Modi, we strive to be an enabler of India's sovereign AI ecosystem with differentiated offerings across the value chain through focused investments and partnerships. We are pleased to start this endeavor in partnership with Odisha government and Sarvam.”

“This is an important milestone in our full-stack AI play and will enable us to serve the large demand for sovereign AI solutions and unlock the scale of our strategic partnership with Sarvam. Odisha offers a progressive policy environment backed by excellent infrastructure and we look forward to working with them in collaboration with Sarvam, added C Vijayakumar, CEO & Managing Director, HCLTech.

According to Pratyush Kumar, Co-Founder, Sarvam, “The Odisha Sovereign AI Park will connect high-performance compute with Indian models and real-world applications. Together with HCLTech, we are excited to bring Sarvam’s full-stack AI capabilities to enterprises and public systems at scale.”

India is among the fastest growing technology markets globally and a growth market for HCLTech. The country’s data center ecosystem is on a rapid growth trajectory, driven by strong demand from a vibrant digital economy, data localization and critical infrastructure needs to support GPU deployments for AI training and inference workloads.

HCLTech to Establish Global Technology Center in Bhubaneswar

• The facility will house 5,000 people and boost the local technology ecosystem in the state

HCLTech, a leading global technology company, today signed a Memorandum of Understanding with the Government of Odisha to set up a world-class Global Technology Center in Bhubaneswar to innovate and deliver AI-led digital solutions to global enterprises.

The Technology Center will complement HCLTech’s proposed AI Data Center in the upcoming Odisha Sovereign AI Park. The Technology Center will house 5,000 people and is expected to start operations by 2028.

HCLTech’s investment will not only contribute to direct and indirect employment but also boost the local talent ecosystem with focus on next-generation skills. Towards this, HCLTech plans to engage deeply with local educational institutions and the government through structured interventions.

Rahul Singh, COO – Corporate Functions, HCLTech said, “At HCLTech, through our New Vistas initiative, we are focused on expanding our presence across India to bring opportunities closer to where the talent is. Odisha offers a great mix of quality infrastructure and vibrant talent pool, and we look forward to developing Bhubaneshwar as one of our key global innovation and delivery hubs.”

Shri Vishal Kumar Dev, IAS, Additional Chief Secretary, Government of Odisha said, “We welcome HCLTech’s decision to establish their footprint in Odisha. Their presence will further embellish Bhubaneshwar’s status as one of India’s most promising technology hubs.”

In India, HCLTech employs 170,000+ people across its technology campuses and centers in Noida, Bengaluru, Chennai, Hyderabad, Pune, Lucknow, Nagpur, Madurai, Vijayawada and GIFT City.

About HCLTech

HCLTech is a global technology company, home to more than 223,000 people across 60 countries, delivering industry-leading capabilities centered around AI, digital, engineering, cloud and software, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology & Services, Semiconductor, Telecom and Media, Retail and CPG, Mobility and Public Services. Consolidated revenues as of 12 months ending June 2026 totaled $14.8 billion. To learn how we can supercharge progress for you, visit hcltech.com.

Intel, 3DGS and Odisha Ink Landmark MoU for India’s Ist Advanced Glass Substrate Facility

Intel, 3DGS Inc. USA, and the Government of Odisha have signed a landmark $3.3 billion MoU to establish India’s first advanced semiconductor glass substrate manufacturing facility in Bhubaneswar–Khurda, positioning Odisha as a global hub for semiconductor technology. The project will generate over 1,800 direct high-skilled jobs and thousands of indirect opportunities.

Glass substrate is a thin, engineered sheet of glass that acts as the base layer on which circuits and chiplets are built.

Semiconductor glass substrate manufacturing technology refers to the use of ultra‑flat, engineered glass panels as the foundational layer (substrate) in advanced chip packaging. Unlike traditional organic laminates or silicon interposers, glass substrates offer superior electrical, thermal, and mechanical properties, enabling faster, more reliable, and denser semiconductor integration.

Key Highlights of the MoU

• Partnership: Signed between the Government of Odisha, Intel Corporation, and 3D Glass Solutions (3DGS) Inc. USA.
• Investment: Estimated at USD 3.3 billion (₹31,600 crore), one of India’s largest high-tech manufacturing investments.
• Location: Facility to be set up in the Bhubaneswar–Khurda region.
• Employment: Over 1,800 direct high-skilled jobs plus significant indirect employment in allied industries.
• Timeline: Implementation in phases over 5–6 years.

Strategic Importance

• Semiconductor Ecosystem Growth: The facility will produce advanced packaging glass core substrates and high-density interconnect substrates, critical for AI, high-performance computing, and next-gen electronics.
• Intel’s Role: Intel will provide technology know-how, process expertise, licensing, and workforce capability building.
• Government Vision: Union Minister Ashwini Vaishnaw emphasized that this MoU aligns with the India Semiconductor Mission, complementing recent partnerships with Applied Materials, Lam Research, Tokyo Electron, Merck Electronics, Tata Electronics, and ASML.

Intel's Involvement 

Intel is deeply involved in semiconductor glass substrate manufacturing as both a technology pioneer and ecosystem enabler. After more than a decade of R&D, Intel unveiled industry‑leading glass substrates in 2023, positioning them as the next leap in advanced packaging for AI, data centers, and high‑performance computing.

In MoU with Odisha, Intel is providing process expertise, design knowledge, and advanced packaging capabilities to enable the Odisha facility to manufacture glass core substrates and high‑density interconnect substrates.

In 2023, Intel announced one of the industry’s first glass substrates, enabling 10x higher interconnect density compared to organic substrates.

Glass Substrate

3DGS Involvement

3D Glass Solutions (3DGS) is the specialist technology partner in semiconductor glass substrate manufacturing. 3DGS involvement is central because it is one of the very few companies worldwide with proprietary expertise in glass core substrates and through‑glass via (TGV) technology.

3DGS is the materials backbone of this partnership. While Intel provides process scaling and ecosystem integration, 3DGS contributes the specialized substrate technology that makes advanced glass packaging possible. Together, they enable India to leapfrog into the future of semiconductor manufacturing.

Economic & Industrial Impact

• Boost to Odisha’s Economy: The project is expected to catalyze Odisha’s industrial growth, supporting its target of becoming a $500 billion economy by 2036 and $1.5 trillion by 2047.
• Cluster Development: Will attract global players, drive cluster-based industrialisation, and strengthen upstream (materials, chemicals, equipment) and downstream (electronics manufacturing, exports) sectors.
• Export Orientation: Facility will contribute to export-oriented manufacturing, enhancing India’s role in the global semiconductor supply chain.

Technical Significance

• Semiconductor Substrates: These are the base layers on which circuits are built, essential for chip performance, power efficiency, and signal transmission.
• Advanced Packaging: Glass core substrates prevent warping and enable multi-chip architectures like AI processors, while HDI substrates allow faster communication between complex chips.

Conclusion

This MoU represents a transformative milestone for India’s semiconductor ambitions. By combining Intel’s global expertise with Odisha’s industrial vision, the project will strengthen India’s domestic semiconductor ecosystem and position Odisha as a strategic global hub for advanced packaging technologies.