
Apple is in early talks with Indian semiconductor firms to begin assembling and packaging iPhone chips locally—a first for the company in India, reported The Economic citing sources familiar with Apple’s preliminary discussions with Indian chipmakers like CG Semi.
This move signals a deeper commitment to India’s role in Apple’s global supply chain and could reshape the country’s semiconductor ecosystem.
Key Developments
- First-time chip packaging in India: Apple has historically limited India’s role to iPhone assembly, but now it’s exploring chip-related processes such as assembly and packaging.
- Partners under consideration: Apple has reportedly held discussions with CG Semi, part of the Murugappa Group, which is building an outsourced semiconductor assembly and test (OSAT) facility in Sanand, Gujarat.
- Focus on display-related chips: Early reports suggest the chips considered for packaging in India may be display driver integrated circuits (DDICs), currently sourced from suppliers in South Korea, Taiwan, and China.
- Strategic timing: Apple is accelerating its India plans to offset higher tariffs in China and diversify supply chains amid geopolitical tensions.
- Jobs and ecosystem impact: India already supports ~350,000 direct and indirect jobs through Apple’s device assembly. Chip packaging could significantly expand this footprint.
Strategic Implications
- For India:
- Boosts India’s semiconductor ambitions, aligning with government initiatives like “Make in India” and the semiconductor incentive program.
- Positions India as more than just a device assembly hub—moving up the value chain into chip packaging and testing.
- For Apple:
- Reduces reliance on China, where tariffs and supply chain risks are rising.
- Strengthens Apple’s ability to meet U.S. and global demand with diversified production bases.
- Ensures resilience by tapping into India’s growing manufacturing infrastructure.
Challenges & Risks
- Quality standards: Apple’s chips must meet stringent reliability benchmarks. CG Semi and other Indian firms will need to prove they can match global suppliers.
- Technology transfer: Chip packaging is complex, requiring advanced equipment and skilled labor. India’s ecosystem is still developing.
- Timeline uncertainty: While Apple aims to shift all iPhone manufacturing for the U.S. market to India by 2026, chip packaging discussions remain exploratory.











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