India’s First 3D Chip Packaging Unit Launched in Odisha, Marking a Semiconductor Breakthrough

India has laid the foundation stone for its first advanced 3D chip packaging unit at Info Valley, Bhubaneswar, marking a historic leap in the country’s semiconductor ambitions and positioning Odisha as a future-ready technology hub.

Key Highlights of the Project

• Location: Info Valley, Bhubaneswar, Odisha
• Investment: ₹1,943.53 crore (₹799 crore central support + ₹399.5 crore state support)
• Promoter: 3D Glass Solutions Inc. (USA) via Heterogeneous Integration Packaging Solutions Pvt. Ltd.
• Production Capacity: 70,000 glass panels annually, 50 million assembled units, 13,000 advanced 3DHI modules
• Timeline: Commercial production by August 2028, full-scale operations by August 2030

Strategic Importance

• National Milestone: First 3D glass substrate packaging facility in India, reducing dependence on imports
• Odisha’s Role: Already home to India’s first compound semiconductor fabrication unit
• Global Context: Linked to technologies from Intel, Lockheed Martin, and Applied Materials
• Sectoral Impact: Products will power AI, high-performance computing, defence electronics, telecommunications, aerospace, and photonics

Leaders’ Statements

• CM Mohan Charan Majhi: Called it a “historic milestone” for Odisha and India
• Union Minister Ashwini Vaishnaw: Highlighted India’s rapid growth in electronics manufacturing; India is now the world’s second-largest mobile phone manufacturer
• State IT Minister Dr. Mukesh Mahaling: Emphasized Odisha’s IT, AI, GCC and Semiconductor Policies 2025 and skill development initiatives

Comparative Context

Factor	Odisha Project	India’s Semiconductor Mission
Investment	₹1,943 crore	Multiple projects across states
Technology	3D glass substrate packaging	Fab units, ATMP facilities
Output	70,000 panels, 50M units	Varies by project
Global Links	3D Glass Solutions (USA)	Intel, Micron, Vedanta partnerships
Timeline	2028–2030	Staggered across 2026–2032

Why It Matters

• Boosts Atmanirbhar Bharat: Strengthens India’s domestic semiconductor ecosystem
• Employment: Thousands of jobs for engineers, diploma holders, and ITI graduates
• Odisha’s Transformation: From resource-based economy to technology-led growth centre
• Global Demand: Bookings for plant output already in place

This project cements Odisha’s place in India’s semiconductor roadmap, aligning with the national vision of self-reliance in high-end electronics manufacturing.

Union Minister Shri Ashwini Vaishnaw congratulated the people of Odisha on the landmark initiative and appreciated the support extended by the State Government.

Highlighting the country’s progress in electronics manufacturing, Shri Vaishnaw said production in the sector has grown six-fold over the past 12 years. “India has now become the world’s second-largest mobile phone manufacturer and emerged as the leading exporter of mobile phones in 2025”, he added.

He further informed that two semiconductor projects have already been approved for Odisha under the India Semiconductor Mission, while three more electronics and semiconductor-related proposals are in the pipeline. “Discussions are also underway with major global companies, including Intel for future investments in the state,” he mentioned.