TCS Launches Chiplet Services to Fast-Track AI and 3D Packaging Designs

Tata Consultancy Services (TCS) has officially launched its Chiplet-Based System Engineering Services, marking a strategic move to support next-gen semiconductor design and bolster India’s ambitions as a global chip hub.

What Are Chiplets?

• Modular integrated circuits that can be combined to form advanced processors.
• Enable mix-and-match flexibility, reduce manufacturing costs, and accelerate time-to-market.

Key Features of TCS’s New Services

• Chiplet Tape-Out Acceleration: Faster design cycles with scalability and reduced latency.
• Advanced Packaging: Includes 2.5D/3D interposers and multi-layer organic substrates for compact, high-performance systems.
• UCIe & HBM Standards: Full-stack design and verification support for Universal Chiplet Interconnect Express and High Bandwidth Memory.
• AI Processor Integration: Already deployed with a North American firm to streamline multi-chip AI systems.

Strategic Timing

• India’s semiconductor market projected to grow from $45–50 billion (2024–25) to $100–110 billion by 2030.
• Backed by the ₹76,000 crore India Semiconductor Mission.
• TCS aims to be a key enabler in this transformation.

“Our chiplet-based engineering services will give semiconductor firms the flexibility and scalability they need to bring next-gen processors to market faster.”
— V Rajanna, President, Technology, Software and Services, TCS

Home to 20% of the world’s chip design engineers, India has semiconductor market that valued at $45–50 billion in 2024-2025, and is projected to more than double to $100–110 billion by 2030. Leading global players are investing in manufacturing and assembly facilities in India.

With government support through the ₹76,000 crore India Semiconductor Mission (ISM), India is positioning itself as a major global hub for chip design and manufacturing.


TCS’ new services are expected to strengthen this momentum by giving both Indian and international companies access to world-class expertise in chip-to-system engineering.