The company unveils the Qualcomm® QCC730, a disruptive micro-power Wi-Fi system for IoT connectivity. This technological breakthrough provides up to 88% lower power than previous generations and can revolutionize products in battery powered industrial, commercial and consumer applications.
Qualcomm also introduced the new Qualcomm RB3 Gen 2 Platform — a comprehensive hardware and software solution designed for IoT and embedded applications. Utilizing the Qualcomm® QCS6490 processor, the RB3 Gen 2 offers a combination of high-performance processing, 10x increase in on-device AI processing, support for quadruple 8MP+ camera sensors, computer vision, and integrated Wi-Fi 6E.
The two technologies unveiled are —
1. Breakthrough Wi-Fi Technology
The Qualcomm QCC730 is a groundbreaking micro-power Wi-Fi system tailored for IoT connectivity. Here are its key features:Unprecedented Low Power Consumption for Extended Battery Life
- The QCC730 delivers up to 88% lower power consumption compared to previous generations, potentially revolutionizing battery-powered industrial, commercial, and consumer applications.
- Its selectable power modes and innovative power management maximize savings for extremely long battery life.
- Developers can choose between hostless or hosted mode, providing extreme flexibility for different use cases.
- It supports internal or external power amplifiers and has integrated, non-volatile memory (RRAM) for ease of design.
- QCC730 fully integrates the on-chip microcontroller, non-volatile memory (NVM), and SRAM, making it versatile and easy to design with.
- Developers can replace or integrate it with traditionally Bluetooth-only applications.
QCC730 comes with an open-source software SDK available on CodeLinaro, allowing cloud connectivity offloading.
It empowers developers with an alternative to traditionally Bluetooth-only applications and enables direct cloud connectivity.
In summary, the Qualcomm QCC730 offers ultra-low micro-power Wi-Fi, scalability, and versatility for IoT applications, making it a powerful choice for connected devices.
2. AI Ready IoT & Industrial Platform
The Qualcomm RB3 Gen 2 Platform is designed to empower developers in creating a broad range of IoT products across various segments, including consumer, enterprise, industrial robotics, and automation.High-Performance Processing
- The RB3 Gen 2 Platform is powered by the Qualcomm QCS6490 processor, offering advanced performance capabilities.
- It combines powerful AI processing, computer vision, and blazing-fast wireless connectivity.
- Developers can leverage the platform's AI acceleration for tasks such as image and video capture, enhancing overall functionality.
- This opens up possibilities for applications in workplace security, automation, and more.
- The platform supports multiple 8MP+ camera sensors, enabling robust computer vision capabilities.
- This feature is essential for applications in robotics, industrial automation, and other visual tasks.
- With built-in Wi-Fi 6E, the RB3 Gen 2 Platform ensures high-speed wireless connectivity.
- This connectivity is crucial for seamless communication in IoT devices.
- Enhanced Bluetooth 5.2 support allows for wireless accessories and efficient communication.
- LE Audio ensures improved audio quality for connected devices.
- The platform offers expandability through interfaces such as GPIOs, I2C, SPI, UART, PCIe, USB, MIPI CSI/DSI, and SDIO.
- Developers can easily integrate additional components and customize their solutions.
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