INVECAS, a leading provider of silicon proven IP Solutions and ASIC Design Services optimized for Advanced Process Technologies, Embedded Software and System-level Solutions headquartered in Santa Clara, CA, today announced that it has signed a definitive agreement, pursuant to which INVECAS will acquire Lattice Semiconductor Corporation (NASDAQ: LSCC) HDMI design team and Simplay Labs subsidiary, which oversees standards compliance and interoperability testing services.
Commenting on the development, Darin G. Billerbeck, Lattice Semiconductor’s President and Chief Executive Officer, said, “This strategic transaction is good for Lattice, INVECAS, and the HDMI ecosystem. It not only helps us to support our existing HDMI ASSP business but also fosters a collaboration between the companies to speed the development and adoption of both existing and new HDMI standards. We are confident that Invecas will continue to pioneer HDMI by providing world class IP and services. Lattice customers should feel confident discussing any HDMI 2.1 IP opportunities directly with INVECAS.”
This transaction will include the transfer of approximately 150 research and development (R&D) staff, labs and other assets from Lattice’s operations in San Jose, CA, Hillsboro, OR, Hyderabad, India, as well as Shanghai and Shenzhen, China.
The transaction has been unanimously approved by the boards of directors of both companies and is expected to close in August 2017.
“This transaction will be a tremendous addition to our technical capabilities as well as to our IP, advanced SERDES and product portfolios. We are fully committed to continue investing in the Lattice team’s strong track record of helping to establish industry standards and new technologies, and driving them to market. This transaction will enable us to broadly influence our customers’ Standards Connectivity roadmaps and will provide better insight into their product development. We share the team’s commitment to building upon its proven success of standards creation and the development of new connectivity innovations,” said Gude.