Intel recently launched a 3G modem called XMM 6255, which the company claims is the world’s smallest 3G modem available in the market. The modem with an area of around 300 sq millimeters is said to be not much bigger than a US one cent coin or a UK penny. The size of the modem has been kept small so that it can be easily embedded in connected devices all around the house.
This new modem from the Intel Company supports dual band HSPA with 5.76 Mb/s maximum upload speed and a 7.2 Mb/s maximum download speed. The 3G modem even supports optional quad-band 2G with external low cost companion chip. The XMM 6255 has the Smart UE2p transceiver. This transceiver is based on the company’s latest Intel Power Transceiver Technology. The technology is capable of combining transmit and receive functionality with a fully integrated power management and power amplifier on a single chip. Such thinking results in reduction of number of components being used, which ultimately results in low costs and smaller sizes.
The 3G modem has been designed especially for security devices, industrial equipments, wearables and even the upcoming devices from the Internet of Things market. According to Intel, the power transceiver featured in the XMM 6255 3G modem protects the radio from damage under high usage conditions, overheating and voltage leaks, this is particularly important for critical loT devices. The XMM 6255 also has an advanced radio architecture that allows the modem to work without any hiccups in low signal network coverage conditions and small devices.
The 3G modem is currently available in the market in u-blox SARA-U2 module and the company is looking forward to updates on the additional partnerships in the coming couple of months.
Sergis Mushell, a research director at Gartner gave a statement to BBC and according to it, this latest offering from the Intel Company is the company’s effort and intent in gaining a strong foothold in the mobile connectivity market. According to him, Intel through this product is trying really hard to get a significant stake in the Internet of Things market, a market where connectivity is the most important thing.